Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.
Ik heb een vraag over het boek: ‘Electromigration in Metals - Ho, Paul S. (University of Texas, Hu, Chao-Kun, Gall, Martin, Sukharev, Valeriy’.
Vul het onderstaande formulier in.
We zullen zo spoedig mogelijk antwoorden.
